Through our research in microelectronics and packaging technology, we are driving the development of reliable future mobility solutions.

We develop innovative technologies and materials for packaging and interconnection technology and test electronic systems for their reliability in operation. We analyze failure patterns and failure mechanisms by means of diverse, state-of-the-art analysis methods, which are also used in development in industry. At the same time, we are developing our own test equipment. We are working on methods for condition monitoring and condition prediction of electrical systems. Using these methods, the remaining service life can be predicted while the product is still in operation and the affected electronics can be replaced in good time before failure. In thermomechanical simulations, we simulate the behavior of electronic components under various operating conditions. Optical systems can be developed in detail in optical simulations. This allows more targeted design of electronic and optical components during development and testing for reliability.

Research categories at our labs:

Development of interconnecting materials

Development of testing equipment

Investigating long-term reliability of the interconnects

Identifying the microdefects inside the interconnecting

Finite element analysis (FEM)

Condition monitoring

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to assistenz-iimo-elger.de.